MIL-PRF-123D
4.4 Qualification inspection. Qualification inspection shall be performed at a laboratory acceptable to the
qualifying agency (see 6.3) on sample units produced with equipment and procedures normally used in production.
4.4.1 Sample size. The number of capacitors to be specified for qualification inspection shall be as specified in
table IX and in appendix E of this specification. Each capacitor style shall be qualified separately.
4.4.2 Test routine. Sample units shall be subjected to the qualification inspection specified in table IX in the order
shown. Sample units shall have been subjected to the in-process screening required by this specification and all
sample units shall be subjected to the inspection of group I. The sample shall then be divided as specified in table
IX as applicable.
4.4.3 Failures. Failures in excess of those allowed in table IX shall be cause for refusal to grant qualification
approval.
*
TABLE IX. Qualification inspection.
Number of
Inspection
Requirement Test method Number of
failures
paragraph
paragraph sample units
to be
1/
inspected
Group I
Radiographic inspection (leaded devices only)
All
N/A
Thermal shock and voltage conditioning
Dielectric withstanding voltage
Insulation resistance +25°C
See
186 min
table XVI
2/
Insulation resistance +125°C
Capacitance
Dissipation factor
Group II
Visual and mechanical examination; material, design,
1
construction and workmanship
15
and 3.25
Destructive physical analysis 3/
Group IIIa - Leaded devices
Terminal strength
12
1
Solderability
Resistance to soldering heat
Group IIIb - Nonleaded devices
Terminal strength
12
1
Solderability
Resistance to soldering heat
Group IV
4/
12
1
Voltage-temperature limits
Moisture resistance
Group V
Humidity, steady state, low voltage
0
12
Vibration, high frequency (leaded capacitors only)
1
Resistance to solvents
Group VI
Life
123
1
1/ A sample unit having one or more defects will be charged as a single defective.
2/ Additional samples over the 186 minimum should be included, based on table XVI to allow for the percent
defective allowable. Twelve additional samples shall be required for nonleaded devices.
*
3/ DPA samples shall be divided with 10 samples subjected to group 1 (see 4.6.11.1) and 5 samples to group 2
(see 4.6.11.2).
4/ Leads may be soldered to chip capacitor to facilitate the tests required in group IV.
15
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