MIL-PRF-123 Capacitors, Fixed, Ceramic Dielectric, \(Temperature Stable And General Purpose\), High Reliability, General Specification ForThis specification covers the general requirements for high reliability, general purpose \(BX and BR\) and temperature stable \(BP and BG\) ceramic dielectric fixed capacitors, leaded and nonleaded for space, missile, and other high reliability applications. Capacitors covered by this specification may be used in critical frequency determining applications, timing circuits, and other applications where absolute stability is required \(BP and BG\), and in applications where appreciable variations in capacitance with respect to temperature, voltage, frequency, and life can be tolerated \(BX and BR\). Life tests in this specification are performed at two times rated voltage at maximum rated temperature, and an assumed acceleration factor of 8:1 is used to relate life test data obtained at two times rated voltage to performance at rated voltage.

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MIL-PRF-123D

Style

Nail head diameter, d

Applied force

Inches

(inches)

.005

0.13

.040 �.005

1 Kg � .1

CKS51

.040

1.02

.040 �.005

1 Kg � .1

CKS52

.045

1.14

.040 �.005

2 Kg � .2

CKS53

.040 �.005

2 Kg � .2

CKS54

FIGURE 5. Lead attachment for chip pull test.

4.6.13 Solderability (see 3.17).

4.6.13.1 Solderability for leaded capacitors (see 3.17.1). Capacitors shall be tested in accordance with method

208 of MIL-STD-202. Two terminations shall be tested.

4.6.13.2 Solderability for nonleaded capacitors (see 3.17.2). Capacitors shall be tested in accordance with

method 208 of MIL-STD-202. The following details and exceptions shall apply:

a. Each chip capacitor shall be immersed in molten solder to a depth of .020 +.010, -.000 inch or the entire

capacitor may be immersed.

b. Number of terminations to be tested: Two.

c. Examination of terminations shall be in accordance with 3.17.2. In case of dispute, the percent coverage

with pinholes or exposed termination material shall be determined by actual measurement in these areas, as

compared to the total area.

4.6.14 Resistance to soldering heat (see 3.18).

4.6.14.1 Resistance to soldering heat for leaded capacitors (see 3.18.1). Capacitors shall be tested in

accordance with method 210 of MIL-STD-202. The following details and exceptions shall apply:

a. Capacitors shall be immersed using procedure 1.

b. Depth of immersion in the molten solder: To within 0.050 inch from the capacitor body (see figure 6).

c. Test condition B: Except that the immersion duration shall be 20 �1 seconds.

d. Cooling time prior to measurement after test: 10 �1, -0 minutes.

e. Measurements before test: Capacitance, DF and IR at +25�C shall be measured and recorded as specified

f. Measurements after test: Capacitors shall meet the requirements of 3.18.1. Capacitance, dissipation factor,

and insulation resistance at +25�C shall be measured and recorded as specified in 4.6.7, 4.6.8, and 4.6.10,

respectively.