MIL-PRF-123D
4.6.9.1 Dielectric. Capacitors shall be tested in accordance with method 301 of MIL-STD-202. The following
details shall apply:
a. Magnitude and nature of test voltage: 250 percent to 400 percent of the direct current rated voltage.
b. Duration of application of test voltage: 5 ±1 seconds. The test voltage shall be raised from 0 to the specified
value within 1 second, maximum.
c. Points of application of test voltage: Between the capacitor-element terminals.
d. Limiting value of surge current: Shall be limited between 30 and 50 milliamperes.
e. Examination after test: Capacitors shall be examined for evidence of damage and breakdown.
4.6.9.2 Body insulation (qualification only). Leaded capacitors shall be tested as specified in 4.6.9.1 with the
following exception: Points of application of test voltage: The encapsulated body of the capacitors shall be brought
into intimate contact with a conductive material not less than .0625 inch (1.588 mm) and not more than .125 inch
(3.18 mm) away from the lead wires. A direct current potential of 500 V dc shall be applied between the two leads
connected together and the tape or foil for a period of 5 ±1 seconds. The test circuit shall be so arranged that the
surge current does not exceed 50 mA.
4.6.10 Insulation resistance (see 3.14). Capacitors shall be tested in accordance with method 302 of MIL-STD-
202. The following details shall apply:
a. Test potential: Rated voltage.
b. Special conditions: If a failure occurs at a relative humidity above 50 percent, the insulation resistance may
be measured again at any relative humidity less than 50 percent.
c. Points of measurement: Between the mutually insulated points.
4.6.11 Destructive physical analysis (see 3.4.1 and 3.15). Capacitors shall be examined in accordance with
4.6.11.1 (group 1), 4.6.11.2 (group 2), and table XVII.
4.6.11.1 Group 1.
4.6.11.1.1 Leaded capacitors. After lead attachment and before encapsulation, or after removing the
encapsulation. Group 1 samples shall be inspected for lead attachment, other assembly-related defects in
4.6.11.1.2 Nonleaded capacitors. To be performed after the application of the final termination coating. The
criteria of appendix B of this specification shall be used.
4.6.11.2 Group 2.
4.6.11.2.1 Leaded capacitors. Without removing the encapsulation. Group 2 samples shall be inspected in
accordance with EIA-469 and for the following encapsulation defects:
a. Voids between the encapsulant and the capacitor body or lead wires.
b. Cracks or voids in the encapsulation. There shall be no voids in the encapsulant greater in diameter than 50
percent of the encapsulant wall thickness.
4.6.11.2.2 Nonleaded capacitors. The group 2 samples shall be inspected in accordance with 5.1.7 through 5.1.9
inclusive, of EIA-469. Primary metallization shall only be included if it was not included in the chip lot in-process
DPA.
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