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MIL-PRF-123 Capacitors, Fixed, Ceramic Dielectric, \(Temperature Stable And General Purpose\), High Reliability, General Specification ForThis specification covers the general requirements for high reliability, general purpose \(BX and BR\) and temperature stable \(BP and BG\) ceramic dielectric fixed capacitors, leaded and nonleaded for space, missile, and other high reliability applications. Capacitors covered by this specification may be used in critical frequency determining applications, timing circuits, and other applications where absolute stability is required \(BP and BG\), and in applications where appreciable variations in capacitance with respect to temperature, voltage, frequency, and life can be tolerated \(BX and BR\). Life tests in this specification are performed at two times rated voltage at maximum rated temperature, and an assumed acceleration factor of 8:1 is used to relate life test data obtained at two times rated voltage to performance at rated voltage.

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MIL-PRF-123D
APPENDIX A
PRE-ENCAPSULATION VISUAL INSPECTION CRITERIA FOR LEADED CAPACITORS
A.1. SCOPE
A.1.1 Scope. This appendix specifies the visual inspection criteria for leaded capacitors. This appendix is a
mandatory part of the specification. The information contained herein is intended for compliance.
A.2. Applicable documents. This section is not applicable to this appendix.
A.3. PROCEDURES FOR INSPECTION AND REJECTION
A.3.1 Method of inspection. Each device shall be examined under 7 power minimum magnification to determine
compliance with the requirements specified herein.
A.3.2 Rejection criteria for both axial and radial leaded devices. Devices that deviate from the material, design, or
construction requirements specified, or that fail to meet the following requirements or those specified in A.4.1 shall
be unacceptable.
A.3.2.1 Chip examination.
a. Cracks in the ceramic.
b. Open delaminations in chips.
c. "Cold" solder joints (frosted or granular in appearance).
d. Solder bridging or potential bridging between opposing terminations.
e. Excess solder.
f. No solder balls on leads.
A.4. SPECIFIC LEAD REJECTION CRITERIA
A.4.1 Axial leaded devices - criteria/assessment.
a. Unit A: Ideal lead to element union. Acceptable (see figure A-1).
b. Unit B: Solder build-up (fillet) on one side only. Acceptable (see figure A-1).
c. Unit C: No solder build-up (fillet), but good element to chip interface. Acceptable (see figure A-1).
d. Unit D: Edge of lead wire does not overhang the edge of the element, and full solder coverage is evidenced.
e. Unit E: Gap in solder joint under the nail head which reduces lead-to-element interface to less than 90
percent coverage. Rejectable (see figure A-3).
f. Unit F: Gap in solder joint under the nail head which reduces lead-to-element interface to less than 90
percent coverage. Rejectable (see figure A-3).
g. Unit G: Gaps or voids in solder joint under the nail head which reduces lead-to-element interface to less than
90 percent coverage. Rejectable (see figure A-3).
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