MIL-PRF-123 Capacitors, Fixed, Ceramic Dielectric, \(Temperature Stable And General Purpose\), High Reliability, General Specification ForThis specification covers the general requirements for high reliability, general purpose \(BX and BR\) and temperature stable \(BP and BG\) ceramic dielectric fixed capacitors, leaded and nonleaded for space, missile, and other high reliability applications. Capacitors covered by this specification may be used in critical frequency determining applications, timing circuits, and other applications where absolute stability is required \(BP and BG\), and in applications where appreciable variations in capacitance with respect to temperature, voltage, frequency, and life can be tolerated \(BX and BR\). Life tests in this specification are performed at two times rated voltage at maximum rated temperature, and an assumed acceleration factor of 8:1 is used to relate life test data obtained at two times rated voltage to performance at rated voltage.

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MIL-PRF-123D

APPENDIX B

VISUAL INSPECTION CRITERIA FOR CHIP CAPACITORS

B.1. SCOPE

B.1.1 Scope. This appendix specifies the visual inspection criteria for chip capacitors. This appendix is a

mandatory part of the specification. The information contained herein is intended for compliance.

B.2. APPLICABLE DOCUMENTS. This section is not applicable to this appendix.

B.3. PROCEDURES FOR INSPECTION AND REJECTION

B.3.1 Method of inspection. Each device shall be examined under 10 power magnification to determine

compliance with the requirements specified herein.

B.3.2 Rejection criteria. Devices that deviate from the material, design or construction requirements specified, or

that fail to meet the following requirements, shall be unacceptable.

B.3.2.1 Termination metallization.

a. End terminals shall be completely covered. Pinholes less than or equal to .005 inch (0.13 mm) in diameter

are permitted (maximum of three pinholes in each surface area).

b. Gaps in the metallization band shall only be acceptable if the metallization band is not less than the minimum

metallization band requirement specified (see figure B-1).

c. Metallized edges shall not be reduced to less than 90 percent due to chipping or metallizing process (see

d. There shall be no excess metallization or solder tear which violates the minimum pad separation (see figure

e. There shall be no foreign material visible adhering to the solder, or voids in the solder revealing greater than

10 percent of the base metallization (see figure B-4).