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MIL-PRF-55365 Capacitor, Fixed, Electrolytic \(Tantalum\), Chip, Established Reliability, Nonestablished Reliability, And High Reliability, General Specification ForThis specification covers the general requirements for non-established reliability \(non-ER\), established reliability \(ER\), and high reliability tantalum dielectric, fixed chip capacitors, primarily intended for use in thick and thin film hybrid circuits or surface mount applications for filter, bypass, coupling, and other applications where the alternating current \(ac\) component is small compared to the direct current \(dc\) rated voltage and where supplemental moisture protection is available \(see 6.1\). The established reliability capacitors have reliability ratings established on the basis of life tests performed at specified voltage at +85??C for failure rate levels \(FRL\) ranging from: a. 1.0 percent per 1,000 hours to 0.001 percent per 1,000 hours in accordance with MIL-STD-690. These FRL?╞s are established at a 60-percent confidence level and are maintained at a 10-percent producer?╞s risk \(exponential distribution\). b. 0.1 percent per 1,000 hours to 0.001 percent per 1,000 hours or 1 FIT \(FIT = failure unit = one failure per 109 device hours\) at 90-percent confidence level \(Weibull distribution\).

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MIL-PRF-55365H

TABLE X. Group C inspection (ER only).

Inspection

Requirement

Method

Number of sample units

Number of failures

paragraph

to be inspected

allowed

Subgroup I

Thermal shock (mounted) 1/

3.15

4.7.12

Subgroup II

Resistance to soldering heat

Moisture resistance

Subgroup III

Life (2,000 hours at +125�C)

3.22

4.7.19

Subgroup IV

Life (10,000 hours at +85�C)

3.22

4.7.19.1

25 minimum per style

See 4.4.4.1

FR (exponential only)

Subgroup V

Resistance to solvents 2/

3.25

4.7.22

1/ If the manufacturer can demonstrate that this test has been performed five consecutive times with zero failures,

this test, with the approval of the qualifying activity, can be performed on an annual basis. If the design,

material, construction or processing of the part is changed or, if there are any quality problems or failures, the

qualifying activity may require resumption of the original test frequency. Group C thermal shock is not required

if thermal shock (mounted) was done as part of group A inspection.

2/ If the manufacturer can demonstrate that this test has been performed five consecutive times with zero failures,

this test, with the approval of the qualifying activity, can be deleted. The manufacturer, however, shall perform

this test every 3 years after the deletion as part of long term design verification. If the design, material,

construction or processing of the part is changed or, if there are any quality problems, the qualifying activity may

require resumption of the specified testing. Deletion of testing does not relieve the manufacturer from meeting

the test requirements in case of dispute.

4.7 Methods of inspection and test.

4.7.1 Mounting for testing. Mounting is optional for test environments; however, when specified in the test

procedures, the chip capacitors shall be mounted on a suitable substrate (e.g., 96 percent alumina, G30 or FR4 glass

epoxy). The substrate material shall be such that it shall not be the cause of, nor contribute to, failure of any test for

which it may be used. The capacitors shall be mounted on the substrate as follows:

a. A substrate shall be prepared with metallized surface land areas of proper spacing to permit mounting of

chips by soldering the terminations of the chips to the "test card" land areas.

b. Solder paste shall be applied to terminals and substrates as applicable or alternative reflow techniques may

be used.

c. The chip shall then be placed across the metallized land areas of the test substrate so as to make contact

between chip and substrate land areas.

d. The substrate shall be exposed to +135�C �15�C for a minimum of 1 minute. The substrate shall then be

transitioned to +245�C �5�C. The substrate shall remain at +245�C �5�C until the solder paste melts and

reflows forming a homogenous solder bond to the metallized substrate.

e. All excess flux or solder shall be removed.