MIL-PRF-55365 Capacitor, Fixed, Electrolytic \(Tantalum\), Chip, Established Reliability, Nonestablished Reliability, And High Reliability, General Specification ForThis specification covers the general requirements for non-established reliability \(non-ER\), established reliability \(ER\), and high reliability tantalum dielectric, fixed chip capacitors, primarily intended for use in thick and thin film hybrid circuits or surface mount applications for filter, bypass, coupling, and other applications where the alternating current \(ac\) component is small compared to the direct current \(dc\) rated voltage and where supplemental moisture protection is available \(see 6.1\). The established reliability capacitors have reliability ratings established on the basis of life tests performed at specified voltage at +85??C for failure rate levels \(FRL\) ranging from: a. 1.0 percent per 1,000 hours to 0.001 percent per 1,000 hours in accordance with MIL-STD-690. These FRL?╞s are established at a 60-percent confidence level and are maintained at a 10-percent producer?╞s risk \(exponential distribution\). b. 0.1 percent per 1,000 hours to 0.001 percent per 1,000 hours or 1 FIT \(FIT = failure unit = one failure per 109 device hours\) at 90-percent confidence level \(Weibull distribution\).

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11

MIL-PRF-55365H

TABLE XII. Normal acceleration factors.

Acceleration factor

Grading stress, Va / Vr

(Va = accelerated voltage; Vr = rated voltage)

1.0000

1.1000

6.5355

1.2000

42.7128

1.3000

279.1496

1.4000

1,824.3823

1.5000

11,923.2626

1.5276

20,000.0000

4.7.21 Solderability (see 3.24). Capacitors shall be tested in accordance with method 208 of MIL-STD-202.

Mounting surfaces shall be dipped to cover the normal mounting surfaces. After the test, the solderable surfaces

shall be examined.

4.7.22 Resistance to solvents (see 3.25). Marked capacitors shall be tested in accordance with

5. PACKAGING

5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order

(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel

need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are

maintained by the Inventory Control Point's packaging activity within the Military Service or Defense Agency, or within

the military service's system commands. Packaging data retrieval is available from the managing Military

Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible

packaging activity.

6. NOTES

(This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.)

6.1 Intended use. Tantalum chip capacitors are intended to be used in thin or thick film hybrid circuits or surface

mount applications where microcircuitry is indicated. These capacitors are not hermetic or moisture proof. These

capacitors are military unique due to the fact that they must be able to operate satisfactorily in military systems under

20 Gs of high frequency vibration and extreme temperatures (-55�C to +125�C). These capacitors also offer high

reliability that is verified under a qualification system. Commercial components are not designed to withstand these

military environmental conditions.

6.2 Acquisition requirements. Acquisition documents must specify the following:

a. Title, number, and date of the specification.

b. Packaging requirements (see 5.1).

c. Title, number, and date of the applicable specification sheet, and the complete type designation (see 3.1).

d. Capacitor marking (see 3.26.3)

6.3 Supplying for logistic support. Chip components require use of sophisticated equipment to remove from and

install on printed wiring boards. Only requisitioners with in-house or contracted capability to replace surface mounted

components should be supplied with chip components, in accordance with their specification.