MIL-PRF-55365H
3.6 Destructive physical analysis (T level only). When examined as specified in 4.7.3, capacitors shall meet the
requirements of MIL-STD-1580, requirement 10, paragraph 10.11 with the following exception.
a. For epoxy molded cased devices, there shall be a silver epoxy attachment joining the cathode terminal to the
silver coated tantalum slug. There shall be a minimum of 25 percent attachment.
b. For devices without epoxy molded cases (orange or blue), there shall be a silver epoxy attachment joining the
cathode end cap to the silver coated tantalum slug. There shall be a minimum of 25 percent attachment (end
of anode slug only).
3.7 Interface and physical dimension. Capacitors shall meet the interface and physical dimensions specified
(see 3.1).
3.7.1 Body structure. The body structure shall be either conformally coated or molded form (see 3.1).
3.7.2 Terminals. Terminals shall be of a solid conductor, of the dimensions specified (see 3.1), and shall be
suitably treated to facilitate soldering.
3.7.2.1 Reprocessing of terminations. The manufacturer (or his authorized category B or category C distributor)
may reprocess the terminations of the capacitors supplied to this specification, provided the termination process has
been approved by the qualifying activity.
3.7.2.2 Reprocessing option. If the manufacturer (or his authorized category B or category C distributor)
reprocesses the terminations of the capacitors as a part of normal production, or as a corrective action for
solderability failure, the following shall apply:
a. Following any reprocessing, the electrical measurements as specified in group A, subgroup 1, shall be
performed on a 200 piece sample for each 8 hours of manufacturing. If there are one or more defects, the
individual inspection lot, or lots, from which the defect originated shall be subjected to 100 percent testing of
the electrical measurements of group A, subgroup 1, and shall meet the percent defective allowable (PDA)
b. PPM data following the reprocessing shall be reported every 6 months. The calculation method shall be in
accordance with EIA-554-1.
3.7.2.3 Tin plated finishes. The use of pure tin, as an underplate or final finish, is prohibited both internally and
externally. Tin content of capacitor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed
with a minimum of 3 percent lead, by mass (see 6.10).
3.8 Voltage aging (exponential only). When tested as specified in 4.7.5, capacitors shall meet the following
requirements:
As specified in 3.9.
DC leakage
Capacitance
As specified in 3.10.
Dissipation factor
As specified in 3.11.
Equivalent Series Resistance (ESR)
As specified in 3.17.
(when specified, see 3.1)
3.9 DC leakage. When measured as specified in 4.7.6, the dc leakage shall not exceed the applicable value
specified (see 3.1).
T level only: When measured as specified in 4.7.6, the dc leakage shall be within +3 standard deviations for the lot.
3.10 Capacitance. When measured as specified in 4.7.7, the capacitance shall be within the applicable tolerance
specified (see 3.1).
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