MIL-PRF-55365 Capacitor, Fixed, Electrolytic \(Tantalum\), Chip, Established Reliability, Nonestablished Reliability, And High Reliability, General Specification ForThis specification covers the general requirements for non-established reliability \(non-ER\), established reliability \(ER\), and high reliability tantalum dielectric, fixed chip capacitors, primarily intended for use in thick and thin film hybrid circuits or surface mount applications for filter, bypass, coupling, and other applications where the alternating current \(ac\) component is small compared to the direct current \(dc\) rated voltage and where supplemental moisture protection is available \(see 6.1\). The established reliability capacitors have reliability ratings established on the basis of life tests performed at specified voltage at +85??C for failure rate levels \(FRL\) ranging from: a. 1.0 percent per 1,000 hours to 0.001 percent per 1,000 hours in accordance with MIL-STD-690. These FRL?╞s are established at a 60-percent confidence level and are maintained at a 10-percent producer?╞s risk \(exponential distribution\). b. 0.1 percent per 1,000 hours to 0.001 percent per 1,000 hours or 1 FIT \(FIT = failure unit = one failure per 109 device hours\) at 90-percent confidence level \(Weibull distribution\).

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MIL-PRF-55365H

3. REQUIREMENTS

3.1 Specification sheets. The individual item requirements shall be as specified herein and in accordance with the

applicable specification sheet. In the event of any conflict between the requirements of this specification and the

specification sheet, the latter shall govern (see 6.2).

3.2 Qualification. Capacitors furnished under this specification shall be products that are authorized by the

qualifying activity for listing on the applicable qualified products list (QPL) before contract award (see 4.4 and 6.4).

Authorized distributors which are approved to MIL-STD-790 distributor requirements by the QPL manufacturer are

listed in the QPL.

3.3 QPL system. The manufacturer shall establish and maintain a QPL system for parts covered by this

specification. Requirements for this system are specified in MIL-STD-790 and MIL-STD-690. In addition, the

manufacturer shall also establish a Statistical Process Control (SPC) and Part Per Million (ppm) system that meets

the requirements as detailed in 3.3.1 and 3.3.2 respectively

3.3.1 SPC system. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish an SPC

system that meets the requirements of EIA-557. Typical manufacturing processes include: Pressing, sintering,

electrochemical processing, encapsulating, and packaging.

3.3.2 PPM system. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish a ppm

system of assessing the average outgoing quality of lots in accordance with EIA-554-1. Data exclusion, in

accordance with EIA-554-1 may be used with approval of the qualifying activity. The ppm system shall identify the

ppm rate at the end of each month and shall be based on a 6-month moving average. Style reporting may include

non-established reliability, established reliability, and high reliability style combinations.

3.4 Materials. Materials shall be as specified herein. However, when a definite material is not specified, a

material shall be used which will enable the capacitors to meet the performance requirements of this specification.

Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the

finished product.

3.5 Radiographic inspection (T level only). When capacitors are tested as specified in 4.7.2, the following shall

apply:

a. For epoxy molded cased devices, there shall be a silver epoxy attachment joining the cathode terminal to the

silver coated tantalum slug. There shall be a minimum of 25 percent attachment.

b. For devices without epoxy molded cases (orange or blue), there shall be a silver epoxy attachment joining the

cathode end cap to the silver coated tantalum slug. There shall be a minimum of 25 percent attachment (end

of anode slug only).

c. For all styles, the conductive epoxy attaching the tantalum slug to the cathode end cap or lead shall not be

separated or cracked.

d. For epoxy molded cased devices, the riser wire-to-external lead weld shall not create a misalignment greater

than 15 degrees between riser and lead. Additionally, this weld shall exhibit molding compound between the

end of the riser wire and the outer package edge.

e. There shall be no pinholes on the conformal coating of CWR06 capacitors that expose any surface of the

capacitor element, or cracks on the molded case of all molded capacitors, or chipouts that reduce the case

wall thickness by 50%. There shall be no stress cracks on the external leads of all molded capacitors.