MIL-PRF-123D
APPENDIX A
h. Unit H: Gap in solder joint under the nail head which reduces lead-to-element interface to less than 90
percent coverage. Rejectable (see figure A-3).
I. Unit I: Diameter of lead wire overhangs side of element. Rejectable (see figure A-3). (Note: Nail head may
overhang.)
j. Unit J: Edge of lead wire does not overhang edge of element, but gap in solder joint under the nail head
reduces lead-to-element interface to less than 90 percent coverage. Rejectable (see figure A-3).
k. Unit K: Center line of nail head tilted greater than 30° beyond center line of chip. Rejectable (see
FIGURE A-1. Acceptable units.
FIGURE A-2. Acceptable only by QC department.
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