MIL-PRF-49464 Capacitors, Chip, Single Layer, Fixed, Parallel Plate, Ceramic Dielectric, Established Reliability, General Specification ForThis specification covers the general requirements for ceramic plate, single layer capacitors. These capacitors are intended for stripline or microstrip applications, usually at frequencies of 1 GHz and higher. Capacitors covered by this specification have failure rate levels \(FRL\) ranging from 1.0 to 0.001 percent per 1,000 hours. These failure rate levels are established at a 90-percent confidence level and maintained at a 10-percent producer\'s risk. They are based on life tests performed at a maximum rated voltage at maximum rated temperature. An acceleration factor of 8:1 has been used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage at rated temperature. Statistical Process Control \(SPC\) techniques are required in the manufacturing process to minimize variation in production of capacitors supplied to the requirements of this specification.

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MIL-PRF-49464C

4.8.11 Immersion (see 3.14). Capacitors shall be tested in accordance with method 104 of MIL-STD-202. The

following details shall apply:

a. Test condition: B.

b. Examinations and measurements after final cycle: Capacitors shall meet the requirements of 3.14.

4.8.12 Humidity, steady state, low voltage (see 3.15). Capacitors shall be tested in accordance with method 103

of MIL-STD-202, condition A. The following details and exceptions shall apply:

NOTE: At no time during test shall voltage greater than 1.55 volts be applied to any capacitor under test.

a. Initial measurements: Capacitance shall be measured in accordance with 4.8.4.

b. Tests: Capacitors shall be subjected to an environment of +85�C with 85 percent relative humidity for 240

hours minimum. Cycling shall not be performed. A dc potential of 1.3 volts �0.25 volts shall be applied

continuously through a 100 kilohm resistor.

c. Final measurements: On completion of test, remove the capacitors from the chamber and allow 3 hours, 30

minutes, �30 minutes for drying and stabilization at 25�C before performing IR (through a 100 kilohm resistor

at 1.3 �0.25 volts) and capacitance in accordance with 4.8.6 and 4.8.4, respectively. The capacitors shall

then be examined for evidence of mechanical damage and obliteration of marking.

d. Leads may be attached to chip capacitors for mounting and loading purposes. Mechanical loading is

acceptable.

4.8.13 Life (at +125�C) (see 3.16). Capacitors shall be tested in accordance with method 108 of MIL-STD-202.

The following details and exceptions shall apply:

a. Capacitors shall be mounted as specified in 4.8.2.

b. Test temperature and tolerance: +125�C, +4�C, -0�C.

c. Operating conditions: Capacitors shall be subjected to 200 percent of rated voltage (see 3.1). The surge

current shall not exceed 50 mA. When necessary, a suitable current-limiting resistor may be inserted into

the circuit.

d. Test condition: F (2,000 hours).

e. Measurements during and after exposure: After 1,000 hours and at the conclusion of this test and while

capacitors are still held at +125�C, insulation resistance shall be measured as specified in 4.8.6. The

capacitors shall then be returned to the inspection conditions specified in 4.3 and shall be visually inspected

for evidence of mechanical damage, and capacitance, dissipation factor, and insulation resistance shall be

measured as specified in 4.8.4, 4.8.5, and 4.8.6, respectively.

f. Final measurement: Capacitors shall meet the requirements of 3.16.

4.8.14 Fungus (see 3.17). Capacitors shall be tested in accordance with method 508 of MIL-STD-810.