MIL-PRF-49464 Capacitors, Chip, Single Layer, Fixed, Parallel Plate, Ceramic Dielectric, Established Reliability, General Specification ForThis specification covers the general requirements for ceramic plate, single layer capacitors. These capacitors are intended for stripline or microstrip applications, usually at frequencies of 1 GHz and higher. Capacitors covered by this specification have failure rate levels \(FRL\) ranging from 1.0 to 0.001 percent per 1,000 hours. These failure rate levels are established at a 90-percent confidence level and maintained at a 10-percent producer\'s risk. They are based on life tests performed at a maximum rated voltage at maximum rated temperature. An acceleration factor of 8:1 has been used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage at rated temperature. Statistical Process Control \(SPC\) techniques are required in the manufacturing process to minimize variation in production of capacitors supplied to the requirements of this specification.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12

MIL-PRF-49464C

2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the

text of this document and the references cited herein (except for related specification sheets), the text of this

document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless

a specific exemption has been obtained.

3. REQUIREMENTS

3.1 Specification sheets. The individual item requirements shall be as specified herein and in accordance with the

applicable specification sheet. In the event of any conflict between the requirements of this specification and the

specification sheet, the latter shall govern.

3.2 Qualification. Capacitors furnished under this specification shall be products that are authorized by the

qualifying activity for listing on the applicable qualified products list (QPL) before contract award. In addition, the

manufacturer shall obtain certification from the qualifying activity that the QPL system requirements of 3.3 and 4.2

have been met and are being maintained. Authorized distributors who are approved to MIL-STD-790 distributor

requirements by the QPL manufacturer are listed in the QPL.

3.3 QPL system. The manufacturer shall establish and maintain a QPL system for parts covered by this

specification. Requirements for this system are specified in MIL-STD-690 and MIL-STD-790. In addition, the

manufacturer shall establish a Statistical Process Control (SPC) system that meets the requirements of 3.3.1.

3.3.1 SPC system. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish an SPC

system which meets the requirements of EIA-557. Typical manufacturing processes for application of SPC include

raw material mixing and blending, dielectric sheet manufacturing, metallization, cutting, and firing.

3.4 Materials. Materials shall be as specified herein. However, when a definite material is not specified, a material

shall be used which will enable the capacitors to meet the performance requirements of this specification.

Acceptance or approval of any constituent material shall not be construed as a guarantee of the acceptance of the

finished product.

3.4.1 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin

content of capacitor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a

minimum of 3 percent lead, by mass (see 6.8).

3.5 Interface and physical dimension requirements. Capacitors shall meet the interface and physical dimensions

specified (see 3.1).

3.5.1 Body structure. The body shall be a single ceramic plate or a single ceramic plate with buried electrodes and

multiple via connections that meets the requirements specified herein (see 3.1).

3.6 Thermal shock and voltage conditioning. When tested as specified in 4.8.3, capacitors shall withstand the

extremes of high and low temperature without visible damage and meet the following requirements:

a. Capacitance (at +25�C): Shall be within the tolerance as specified in 3.7.

b. Dissipation factor (at +25�C): Shall not exceed the value as specified in 3.8.

c. Insulation resistance (at +25�C): Shall not be less than the value specified in 3.9.

d. Dielectric withstanding voltage (at +25�C): Shall be as specified in 3.10. Not applicable if optional voltage

conditioning was performed at or above 250 percent of rated voltage.