MIL-PRF-49464 Capacitors, Chip, Single Layer, Fixed, Parallel Plate, Ceramic Dielectric, Established Reliability, General Specification ForThis specification covers the general requirements for ceramic plate, single layer capacitors. These capacitors are intended for stripline or microstrip applications, usually at frequencies of 1 GHz and higher. Capacitors covered by this specification have failure rate levels \(FRL\) ranging from 1.0 to 0.001 percent per 1,000 hours. These failure rate levels are established at a 90-percent confidence level and maintained at a 10-percent producer\'s risk. They are based on life tests performed at a maximum rated voltage at maximum rated temperature. An acceleration factor of 8:1 has been used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage at rated temperature. Statistical Process Control \(SPC\) techniques are required in the manufacturing process to minimize variation in production of capacitors supplied to the requirements of this specification.

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MIL-PRF-49464C

1.2.1.7 Termination finish. The termination finish is identified by the letter H.

H: A minimum of 100 microinches of 99.99 percent gold, on both sides. This is suitable for gold wire bonding

and conductive epoxy or AuSn eutectic die attachment.

1.2.1.8 Failure rate level (FRL). The FRL is identified by a single letter as shown in table IV.

TABLE IV. FRL.

Symbol

FRL (percent per 1,000 hours)

1.0

0.1

0.01

0.001

2. APPLICABLE DOCUMENTS

2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This

section does not include documents cited in other sections of this specification or recommended for additional

information or as examples. While every effort has been made to ensure the completeness of this list, document

users are cautioned that they must meet all specified requirements of the documents cited in sections 3 and 4 of this

specification, whether or not they are listed.

2.2 Government documents.

2.2.1 Specifications. standards. and handbooks. The following specifications, standards, and handbooks form a

part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are

those cited in the solicitation or contract (See 6.2).

DEPARTMENT OF DEFENSE SPECIFICATIONS

Capacitors, Chip, Single Layer, Fixed Unencapsulated, Ceramic Dielectric,

Established Reliability, Style CPCR01 (High Frequency).

DEPARTMENT OF DEFENSE STANDARDS

Electronic and Electrical Component Parts, Test Methods for.

Failure Rate Sampling Plans and Procedures.

Standard Practice for Established Reliability and High Reliability Qualified

Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts

Specifications.

Environmental Engineering Considerations and Laboratory Tests.

Test Methods and Procedures for Microelectronics.

(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch or from the

Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.3 Non-Government publications. The following documents form a part of this document to the extent specified

herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

ELECTRONIC INDUSTRIES ALLIANCE (EIA)

Statistical Process Control Systems. (DoD Adopted).

(Copies of these documents are available from https://global.ihs.com or Global Engineering Documents, Attn:

Customer Service Department, 15 Inverness Way East, Englewood CO 80112-5776.)