MIL-PRF-55365 Capacitor, Fixed, Electrolytic \(Tantalum\), Chip, Established Reliability, Nonestablished Reliability, And High Reliability, General Specification ForThis specification covers the general requirements for non-established reliability \(non-ER\), established reliability \(ER\), and high reliability tantalum dielectric, fixed chip capacitors, primarily intended for use in thick and thin film hybrid circuits or surface mount applications for filter, bypass, coupling, and other applications where the alternating current \(ac\) component is small compared to the direct current \(dc\) rated voltage and where supplemental moisture protection is available \(see 6.1\). The established reliability capacitors have reliability ratings established on the basis of life tests performed at specified voltage at +85??C for failure rate levels \(FRL\) ranging from: a. 1.0 percent per 1,000 hours to 0.001 percent per 1,000 hours in accordance with MIL-STD-690. These FRL?╞s are established at a 60-percent confidence level and are maintained at a 10-percent producer?╞s risk \(exponential distribution\). b. 0.1 percent per 1,000 hours to 0.001 percent per 1,000 hours or 1 FIT \(FIT = failure unit = one failure per 109 device hours\) at 90-percent confidence level \(Weibull distribution\).

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11

MIL-PRF-55365H

6.7.3 Weibull grading method. After determining the lot FR in accordance with 4.7.20, the balance of the lot (when

applicable) should be tested to the same voltage acceleration conditions as the monitored test samples. These

sample units shall then be subjected to the 100-percent electrical tests shown in table VIII.

6.8 Termination finish code conversion. Termination finish codes in this revision (see 1.2.1.3) replace those from

earlier revisions in the following manner:

TABLE XIII. Termination finish code.

Termination finish codes

Replace earlier revision termination finish codes

B (gold plated)

B (gold)

C (hot solder dipped)

A (solder-coated nickel)

H (solder plated)

C (solder-coated gold)

K (solder fused)

D (solder-coated alloy 725)

F (solder-coated alloy 752)

6.9 Subject term (key word) listing.

Dissipation factor

Statistical process control (SPC)

Weibull

6.10 Tin whisker growth. The use of alloys with a tin content greater than 97 percent, by mass, may exhibit tin

whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacturer

and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied

over top of a whisker prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass,

have been shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545

(Standard Specification for Electrodeposited Coatings of Tin).

6.11. Environmentally preferable material. Environmentally preferable materials should be used to the maximum

extent possible to meet the requirements of this specification. As of the dating of this document, the U.S.

Environmentally Protection Agency (EPA) is focusing efforts on reducing 31 priority chemicals. The list of chemicals

is available on their website at https://www.epa.gov/epaoswer/hazwaste/minimize/chemlist.htm. Further information is

available at the following EPA site: https://www.epa.gov/epaoswer/hazwaste/minimize/. Included in the EPA list of 31

priority chemicals are cadmium, lead, and mercury. Use of the materials on the list should be minimized or

eliminated unless needed to meet the requirements specified herein (see Section 3).

6.12 Changes from previous issue. The margins of this specification are marked with asterisks to indicate

modifications generated by this issue. This was done as a convenience only and the Government assumes no

liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the

requirements of this document based on the entire content irrespective of the marginal notations.