MIL-C-5 Capacitors, Fixed, Mica Dielectric, General Specification ForThis specification covers the general requirements for molded and dipped mica dielectric, fixed capacitors intended primarily for use in high-stability, low-loss radio-frequency applications such as tuned circuits \(see 6.1\). This is a graded specification covering ranges in temperature coefficient, capacitance, tolerance, temperature, and vibration.

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MIL-C-5G

3.9 Capacitance. When measured as specified in 4.6.6, the capacitance shall be within the tolerance shown in the

type designation (see 3.1).

FIGURE 1. Dissipation factor.

3.10 High frequency vibration. When capacitors are tested as specified in 4.6.7, there shall be no mechanical

damage, intermittent contacts, nor open-circuiting or short-circuiting.

3.11 Thermal shock and immersion. When tested as specified in 4.6.8, capacitors shall meet the following

requirements:

Dielectric withstanding voltage

As specified in 3.5

Insulation resistance

At least 30 percent of initial requirement.

Dissipation factor

Not greater than 150 percent of initial requirement.

Capacitance

Change from the value obtained when measured as specified in 4.6.6

shall not exceed the value specified (see 3.1).

3.12 Shock (specified pulse). When capacitors are tested as specified in 4.6.9, there shall be no visible

mechanical damage, intermittent contacts of 0.5 millisecond (ms) or greater duration, nor open-circuiting or short-

circuiting.

3.13 Solderability. When capacitors are tested as specified in 4.6.10, the dipped surface of the capacitor lead to

be inspected shall be limited to a one-inch area extending outward from .050 inch of the capacitor body for molded

units and from the epoxy coating or from the bottom of the crimp, as applicable, for dipped units. Of this area, at least

95 percent shall be covered with a new smooth, solder coating. The remaining 5 percent of the surface to be

inspected shall show only small pinholes or voids; these shall not be concentrated in one area. Bare base metal and

areas where the solder dip failed to cover the original coating are indications of poor solderability, and shall be cause

for failure when their total area exceeds 5 percent of the surface to be inspected. In case of dispute, the percent

coverage with pinholes or voids, shall be determined by actual measurements of these areas, as compared to the

total area.