MIL-PRF-49137E
3.4.2.1.1 Qualifying activity approval. Approval of the solder dip process shall be based on one of the following
options:
a. When the original lead finish qualified was hot solder dip lead finish 52 in accordance with MIL-STD-1276
(NOTE: The 200 microinch maximum thickness is not applicable). The manufacturer shall use the same
solder dip process for retinning as was used in the original manufacture of the capacitor.
b. When the lead originally qualified was not solder dip lead finish 52 of MIL-STD-1276 as prescribed in
3.4.2.1.1a, approval for the process to be used for solder dip shall be based on the following procedure:
(1) Thirty samples of any capacitance value for each style and lead finish shall be subjected to the
manufacturer's solder dip process. The capacitors shall be subjected to all prescreen electrical tests, with
no defects allowed.
(2) Ten of the 30 samples shall be subjected to the solderability test, with no defects allowed.
(3) The remaining 20 samples shall be subjected to the resistance to soldering heat test, followed by the
moisture resistance test, with no defects allowed.
3.4.2.1.2 Solder dip/retinning options. The capacitor manufacturer may solder dip/retin after the prescreen tests or
as a corrective action. After solder dip/retinning, the following inspection and tests shall be performed on 100 percent
of the lot:
a. DC leakage: Shall not exceed the requirement specified in 3.7.
b. Capacitance: Shall be within the tolerance specified (see 3.1).
c. Dissipation factor: Shall not exceed the requirement specified in 3.9.
3.4.2.2 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally.
Tin content of capacitor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a
minimum of 3 percent lead, by mass (see 6.3).
3.5 Voltage aging. When tested as specified in 4.8.2, capacitors shall withstand the application of voltage at high
temperature without visible mechanical damage.
3.6 Construction analysis (metal cased units only). When capacitors are inspected as specified in 4.8.3,
construction analysis shall disclose no evidence of voids of the plastic end-fill exceeding 20 percent of the total case
volume.
3.7 DC leakage. When measured as specified in 4.8.4, the dc leakage shall not exceed the applicable value
specified (see 3.1).
3.8 Capacitance. When measured as specified in 4.8.5, the capacitance shall be within the applicable tolerance
specified (see 3.1).
3.9 Dissipation factor. When measured as specified in 4.8.6, the dissipation factor shall not exceed the value
specified (see 3.1).
3.10 Shock (specified pulse). When capacitors are tested as specified in 4.8.7, there shall be no intermittent
contacts of 0.5 millisecond (ms) or greater duration, or arcing or other indication of breakdown, nor shall there be any
open-circuiting or short-circuiting or evidence of mechanical damage.
3.11 Vibration, high frequency. When capacitors are tested as specified in 4.8.8, there shall be no intermittent
contacts of 0.5 ms or greater duration, or arcing or other indication of breakdown, nor shall there be any open-
circuiting or short-circuiting or evidence of mechanical damage.
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