MIL-PRF-49137E
4.8.16 Solderability (see 3.19). Capacitors shall be tested in accordance with method 208 of MIL-STD-202. The
following details shall apply:
a. The number of terminations of each capacitor to be tested: 2.
b. Depth of immersion in flux and solder: All terminals shall be immersed to within .125 inch (3.18 mm) of the
capacitor body.
4.8.17 Resistance to solvents (see 3.20). Capacitors shall be tested in accordance with method 215 of MIL-STD-
202. The following exceptions shall apply:
a. Brushing is required.
b. Measurements and examination after test: DC leakage, capacitance, and dissipation factor shall be
measured as specified in 4.8.4, 4.8.5 and 4.8.6, respectively. The marking shall remain legible and shall not
smear.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order
(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel
need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are
maintained by the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or
within the military service's system commands. Packaging data retrieval is available from the managing Military
Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible
packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. Capacitors covered by this specification are intended mainly for use in filter, bypass, coupling,
blocking, and other low-voltage applications (such as transistor circuits) where stability, size, weight, and shelf life are
important factors. These capacitors are intended to be used only where supplemental moisture protection is provided
or for noncritical applications where hermetic moisture protection is not required. These capacitors also are verified
under a qualification system. Commercial components are not designed to withstand these military environmental
conditions.
6.2 Acquisition requirements. Acquisition documents must specify the following:
a. Title, number and date of the specification, the applicable specification sheet, and the complete PIN (see
1.2.1).
b. Packaging requirements (see 5.1).
6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent by mass, may exhibit tin whisker
growth problems after manufacturer. Tin whiskers may occur anytime from a day to years after manufacture and can
develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top
of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have
shown to inhibit the growth of tin whiskers. For additional information of this matter, refer to ASTM-B545 (Standard
Specification for Electrodeposited Coatings of Tin).
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