MIL-PRF-49137E
4.6.1.3 Group A inspection. Group A inspection shall consist of the inspections specified in table V, in the order
shown.
TABLE V. Group A inspection.
Test
Requirement
Sampling
Inspection
method
paragraph
procedure
paragraph
Subgroup 1
DC leakage
20 samples
Capacitance
0 failures
Dissipation factor
Subgroup 2
Visual and mechanical
inspection
13 samples
and 3.23
0 failures
Construction analysis
(metal cased units only)
Subgroup 3
13 samples
Solderability
0 failures
4.6.1.3.1 Subgroup 1 and subgroup 2.
4.6.1.3.1.1 Sampling plan. The sampling plan for subgroup 1 and subgroup 2 shall be as specified in table V.
4.6.1.3.1.2 Rejected lots. The rejected lot shall be segregated from new lots and those lots that have passed
inspection. The rejected lot shall be 100 percent inspected for those quality characteristics found defective in the
sample and any defective found shall be removed from the lot. A new sample of parts shall then be randomly
selected in accordance with table V. If one or more defects are found in this second sample, the lot shall be rejected
and shall not be supplied to this specification.
4.6.1.3.2 Subgroup 3 (solderability).
4.6.1.3.2.1 Sampling plan. Thirteen samples shall be selected randomly from every inspection lot and subjected to
the subgroup 3 solderability test. The manufacturer may use electrical rejects from the subgroup 1 screening test for
all or part of the samples to be used for solderability testing. If there are one or more defects, the lot shall be
considered to have failed.
4.6.1.3.2.2 Rejected lots. In the event of one or more defects, the inspection lot shall be rejected. The
manufacturer may use one of the following options to rework the lot:
a. Each production lot that was used to form the failed inspection lot shall be individually submitted to the
solderability test as required in 4.6.1.3.2.1. Production lots that pass the solderability test are available for
shipment. Production lots failing the solderability test can be reworked only if submitted to the solder dip
procedure in item 4.6.1.3.2.2b.
b. The manufacturer shall submit the failed lot to a 100 percent solder dip using an approved solder dip process
in accordance with 3.4.2.1. Following the solder dip, the electrical measurements required in group A,
subgroup 1 tests shall be repeated on another 125 samples with no defects allowed. Thirteen additional
samples shall then be selected and subjected to the solderability test with no defects allowed. If the lot fails
this solderability test, the lot shall be considered rejected and shall not be furnished against the requirements
of this specification.
4.6.1.3.2.3 Disposition of samples. The solderability test is considered a destructive test and samples submitted to
the solderability test shall not be supplied on the contract.
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