MIL-PRF-39001 Capacitors, Fixed, Mica Dielectric, Established Reliability And Nonestablished Reliability, General Specification ForThis specification covers the general requirements for established reliability \(ER\) and nonestablished reliability \(non-ER\), mica dielectric, fixed capacitors \(see 6.1\). The ER capacitors have a failure rate level \(FRL\) ranging from 1.0 percent per 1,000 hours to 0.001 percent per 1,000 hours \(see 1.2.1.7\). The FRL is established at a 90 percent confidence level. The FRL, identified by the applicable symbol specified in table V is referred to operational life at full rated voltage \(see 1.2.1.6\) at 125 degrees C or 150 degrees C, as applicable. An acceleration factor of 25:1 has been used to relate the life test at 150 percent of rated voltage at rated temperature to rated voltage at rated temperature.

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MIL-PRF-39001E

3.2 Qualification. Capacitors furnished under this specification shall be products that are authorized by the

qualifying activity for listing on the applicable Qualified Products List (QPL) before contract award (see 4.4 and 6.4).

Authorized distributors which are approved to MIL-STD-790 distributor requirements by the QPL manufacturers are

listed in the QPL.

3.3 QPL system. The manufacturer shall establish and maintain a QPL system for parts covered by this

specification. Requirements for this system are specified in MIL-STD-790 and MIL-STD-690. In addition, the

manufacturer shall also establish a Statistical Process Control (SPC) and Part Per Million (ppm) system that meets

the requirements as detailed in 3.3.1 and 3.3.2 respectively.

3.3.1 SPC system. As part of the overall MIL-STD-790 QPL system the manufacturer shall establish a SPC

system that meets the requirements of EIA-557.

3.3.2 PPM. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish a ppm system of

assessing the average outgoing quality of lots in accordance with EIA-554-1. Data exclusion, in accordance with

EIA-554-1, may be used with approval of the qualifying activity. The ppm system shall identify the ppm rate at the

end of each month and shall be based on a 6-month moving average. Style reporting may include both ER and non-

ER style combinations.

3.4 Material. The material shall be as specified herein. However, when a definite material is not specified, a

material shall be used which will enable the capacitors to meet the performance requirements of this specification.

Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the

finished product.

3.4.1 Terminal leads. Leads shall be solderable and meet the solderability requirements of 3.12.

3.4.2.1 Solder dip (retinning) leads. Only the manufacturer (or his authorized category B or category C distributor)

may solder dip/retin the leads of products supplied to this specification provided the solder dip process has been

approved by the qualifying activity (see 3.4.2.3).

3.4.2.2 Qualifying activity approval. Approval of the solder dip process shall be based on one of the following

options:

a. When the original lead finish qualified was hot solder dip lead finish 52 of MIL-STD-1276, the manufacturer

shall use the same solder dip process for retinning as is used in the original manufacture of the product.

(NOTE: The 200 microinch maximum thickness is not applicable.)

b. When the lead originally qualified was not hot solder dip lead finish 52 of MIL-STD-1276 as prescribed in

3.4.2.2a., approval for the process to be used for solder dip shall be based on the following test procedure:

(1) Thirty samples of any capacitance value for each style and lead finish are subjected to the

manufacturer's solder dip process. Following the solder dip process, the capacitors are subject to the

high voltage stabilization, dielectric withstanding voltage (DWV), insulation resistance (IR),

capacitance, and dissipation factor (DF) measurements. No defects are allowed.

(2) Ten of the 30 samples are then subjected to the solderability test. No defects are allowed.

(3) The remaining 20 samples are subject to the resistance to solder heat test. No defects are allowed.

(NOTE: Solder dip of gold plated leads is not allowed.)