MIL-PRF-39001E
TABLE IX. Sampling plans.
Lot size
Sample size
1-
150
13
151 -
280
20
281 -
500
29
501 - 1,200
34
1,201 - 3,200
42
3,201 - 10,000
50
10,001 - 35,000
60
35,001 - 150,000
74
150,000 - 500,000
90
TABLE X. Group A inspection (ER only).
Requirement
Test method
Sample
Inspection
paragraph
paragraph
procedure
Subgroup 1
High voltage stabilization
4.7.3
Dielectric withstanding voltage
4.7.2
Insulation resistance (at 25C)
4.7.5
100% inspection
Capacitance
4.7.6
Dissipation factor
4.7.7
Subgroup 2 1/
Visual and mechanical examination
(including dimensions)
See table IX
Subgroup 3
Insulation resistance (at 125C)
4.7.5.2
20 samples
0 failures
Subgroup 4
Solderability 2/
4.7.8
5 samples
0 failures
1/ Marking defects are based on visual inspection only and shall be charged only for illegible,
incomplete, or incorrect marking. Any subsequent electrical defects shall not be used as a
basis for determining marking defects.
2/ The manufacturer may request the deletion of the subgroup 4 solderability test, provided
an in-line or process control system for assessing and assuring the solderability of leads
can be validated and approved by the qualifying activity. Deletion of the test does not
relieve the manufacturer from meeting this test requirement in case of dispute. If the
design, material, construction, or processing of the part is changed, or if there are any
quality problems, the qualifying activity may require resumption of the test.
4.6.1.2.2.4 Subgroup 4 (solderability).
4.6.1.2.2.4.1 Sampling plan. Five samples shall be selected randomly from each inspection lot and subjected to
the solderability test. The manufacturer may use electrical rejects from the subgroup 1 screening test for all or part
of the samples to be used for solderability testing. If there are one or more defects, the lot shall be rejected.
4.6.1.2.2.4.2 Rejected lots. In the event of one or more defects, the inspection lot is rejected. The manufacturer
may use one of the following options to rework the lot:
a. Each production lot that was used to form the failed inspection lot shall be individually submitted to the
solderability test as required in 4.6.1.2.2.4.1. Production lots that pass the solderability test are available for
shipment. Production lots failing the solderability test can be reworked only if submitted to the solder dip
procedure in 4.6.1.2.2.4.2b.
13
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