MIL-PRF-87164A
3.5.2 Connections. All electrodes (foils, clips, and leads) used as terminations for the silvered mica conductor
must be mechanically and electrically bonded together. Foils (and solder if used) must have a minimum melting
point of 260°C. Solder, if used, for bonding the lead wires to the clips shall have a minimum melting point of 182°C
and will be of the same alloy as the tin-lead coating on the lead wire.
3.6 Dielectric withstanding voltage. The capacitors shall withstand the direct current (dc) potential specified in
4.7.2 without damage, arcing, or breakdown.
3.7 Barometric pressure. The capacitors shall withstand the dc potential specified in 4.7.3 without damage,
arcing, or breakdown.
3.8 Insulation resistance.
3.8.1 At room ambient temperature. When measured as specified in 4.7.4.1, the insulation resistance shall be
not less than the applicable value specified on figure 1.
3.8.2 At high ambient temperature. When measured as specified in 4.7.4.2, the insulation resistance shall be not
less than the applicable value specified on figure 1.
3.9 Capacitance. When measured as specified in 4.7.5, the capacitance shall be within the tolerance designated
by the PIN (see 3.1).
3.10 Dissipation factor. When measured as specified in 4.7.6, the dissipation factor shall not exceed the
applicable value shown on figure 2.
3.11 High voltage stabilization. When the capacitors are tested as specified in 4.7.7, there shall be no evidence
of damage, arcing, or breakdown; and the insulation resistance shall be not less than the applicable value specified
on figure 1.
3.12 Solderability. When the capacitors are tested as specified in 4.7.8, the dipped surface of the lead shall be at
least 95 percent covered with continuous new solder coating. The remaining 5 percent of the lead surface shall
show only small pinholes or voids. These shall not be concentrated in one area. No individual view of the dipped
surface shall show less than 95 percent coverage. Bare base metal and areas where the solder dip failed to cover
the original coating are indications of poor solderability, and shall be cause for failure. In case of dispute, the
percent of coverage with pinholes or voids shall be determined by actual measurement of these areas, as compared
to the total area.
3.13 Vibration, high frequency. When the capacitors are tested as specified in 4.7.9, there shall be no intermittent
contacts of 0.5 milliseconds (ms) or greater duration, or momentary arcing, or other indication of breakdown, nor
shall there be any open-circuiting or short-circuiting or evidence of mechanical damage.
3.14 Temperature coefficient and capacitance drift. When measured as specified in 4.7.10, the temperature
coefficient and capacitance drift shall be within the limits specified in table I for the characteristic listed (see 3.1).
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