MIL-PRF-14409J
4.5.20 Rotational life (see 3.23). Capacitors shall be mounted by their normal mounting means with the adjusting
screw set at approximately 20 percent of maximum rated capacitance. The screw shall be rotated four complete
revolutions in the direction of increasing capacitance, then four complete revolutions in the direction of decreasing
capacitance. This cycle shall be repeated 75 times at a rate of 5 cycles per minute. Following the final cycle,
dielectric withstanding voltage shall be measured as specified in 4.5.6. Then capacitors shall be set at approximately
10 percent of the maximum rated capacitance value above the minimum rated capacitance value or 1.0 pF,
whichever is greater, and then the rotor shall be rotated in steps of two turns until 90 percent of maximum rated
capacitance is reached. Capacitance measurements at a minimum of three steps shall be recorded. Capacitance
shall be measured after each step at a frequency of .001 or 1.0 MHz ±10 percent and shall be continuously monitored
for reversals. The accuracy of the rotation shall be within ±5° per revolution. Reproducibility of the measurements
shall be within ±0.1 percent or 0.01 pF, whichever is greater. Following measurements of capacitance change versus
rotation, driving torque at room ambient temperature shall be measured as specified in 4.5.8.1. Without further
rotation after the driving torque measurement contact resistance shall be measured between the rotor screw and the
mounting base. Disassembly may be necessary for this measurement.
4.5.21 Solderability (see 3.24). Capacitors shall be tested in accordance with method 208 of MIL-STD-202. All
solderable terminations of each part shall be tested.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or
order (see 6.1). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these
personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging
requirements are maintained by the Inventory Control Point's packaging activities within the Military Service or
Defense Agency, or within the military service's system commands. Packaging data retrieval is available from the
managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting
the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Acquisition requirements. Acquisition documents must specify the following:
a. Title, number, and date of this specification, the applicable specification sheet and the complete PIN (see
1.2.1).
b. Packaging requirements (see 5.1).
6.2 Qualification. With respect to products requiring qualification, awards will be made only for products that are,
at the time of award of contract, qualified for inclusion in Qualified Products List whether or not such products have
actually been so listed by that date. The attention of the contractors is called to these requirements, and
manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested
for qualification in order that they may be eligible to be awarded contracts or orders for the products covered by this
specification. Information pertaining to qualification of products may be obtained from the DLA Land and Maritime,
ATTN: VQP, PO Box 3990, Columbus, OH 43218-3990, or by e-mail to vqp.chief@dla.mil. An online listing of
products qualified to this specification may be found in the Qualified Products Database (QPD) at
6.2.1 Copies of SD-6, "Provisions Governing Qualification" may be obtained upon application to Standardization
Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094
6.3 Substitutability data. For a cross reference of the substitutability relationship of superseded styles PC38,
PC40, PC41, PC42, PC46, and PC47 characteristics J and H only, see the applicable specification sheet (see 3.1).
6.4 Mounting. It is recommended that the capacitor bodies have adequate heat sink during mounting operation
with high temperature solder.
16
For Parts Inquires submit RFQ to Parts Hangar, Inc.
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business