MIL-DTL-3965H
APPENDIX B
SOLDER DIP (RETINNING) LEADS
B1. SOLDER DIP (RETINNING) LEADS
B1.1 Solder dip (retinning). Only the manufacturer (or his authorized category B distributor) may solder dip/retin
the leads of the capacitors supplied to this specification, provided the solder dip process (see appendix C) has been
approved by the qualifying activity.
B1.2 Solder dip (retinning) leads (axial-wire leads only). Only the manufacturer (or his authorized category B
distributor) may solder dip-retin the leads of capacitors supplied to this specification, provided the solder dip process
has been approved by the qualifying activity.
B1.3 Qualifying activity approval. Approval of the solder dip process will be based on one of the following options:
a.
When the original lead finish qualified was hot solder dip led finish 52 of MIL-STD-1276, the manufacturer
shall use the same solder dip process for retinning as is used in the original manufacture of the product or
one authorized by the manufacturer with approval based on the method outlined in B1.2b.
(NOTE: The 200 microinches maximum thickness requirement is not applicable.)
b.
When the lead finish originally qualified was not hot solder dip lead finish 52 of MIL-STD-1276 as prescribed
in 3.5.1.1a, approval for the process to be used for solder dip shall be based on the following test procedure:
(1) Thirty samples of the hermetic seal and 30 samples of the nonhermetic seal of any solder process.
Following the solder process, the capacitors shall be subjected to the electrical test of group A
inspection (including the hermetic seal test if the device is hermetically sealed), with no defects allowed.
(2) Ten of the 30 samples shall then be subjected to the solderability test, with no defects allowed.
(3) The remaining 20 samples shall be subjected to the resistance to soldering heat test followed by the
moisture resistance test (or hermetic seal test if the device is hermetically sealed), with no defects
allowed.
B1.4 Solder dip/retinning options. Only the manufacturer (or his authorized category B distributor) may solder dip-
retin as follows:
a.
As a corrective action if the lot fails the group A solderability test.
b.
After a group A screening test. Following the solder dip/retinning process, the electrical and seal tests
specified in group A, subgroup 1 shall be performed on a 13 piece sample randomly selected from the
inspection lot. If there are one or more defects, 100 percent of the lot shall then be subjected to the test(s)
from which the defect(s) originated. Following the test(s), the manufacturer shall submit the lot to the group
A solderability test as specified in 4.7.12.
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