MIL-C-11272E
THE INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS INC. (IPC)
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Requirements for Soldering Fluxes.
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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed
Solid Solders for Electronic Soldering Applications.
(Copies of these documents can be ordered online at www.ipc.org or from the Institute for Interconnecting and
Packaging Electronic Circuits (IPC, INC.), 2215 Sanders Road, Suite 200 South, Northbrook, IL 60062.)
INTERNATIONAL ORGANIZATION FOR STANDARDS (ISO)
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Quality Assurance Requirements for Measuring Equipment - Part I: Metrological
Confirmation System for Measuring Equipment.
(Copies of this document may be ordered online at https://webstore.ansi.org/ or from the American National
Standards Institute, 11 West 42nd Street, New York, NY 10036-0350)
2.4 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein (except for related associated specifications, specification sheets, or MS sheets), the text of this document
takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS:
3.1 Specification sheets. The individual item requirements shall be as specified herein and in accordance with the
applicable specification sheet. In the event of any conflict between requirements of this specification and the
specification sheets, the latter shall govern. (see 6.2)
3.2 Qualification. Capacitors furnished under this specification shall be a product which has been tested and has
passed the qualification tests specified in 4.4, and has been listed on or approved for listing on the applicable
qualified products list (see 6.3).
3.3 Material. The material shall be as specified herein. However, when a definite material is not specified, a
material shall be used which will enable the capacitors to meet the performance requirements of this specification.
Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the
finished product.
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3.3.1 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin
content of capacitor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a
minimum of 3 percent lead, by mass (see 6.6).
3.3.2 Solder. Solder for electrical connections shall be in accordance with J-STD-006. In no case shall the solder
start to melt at a temperature of less than 200°C.
3.3.3 Soldering flux. Soldering flux shall be in accordance with J-STD-004.
3.4 Design and construction. Capacitors shall be of the design, construction, and physical dimensions specified
(see 3.1).
3.4.1 Capacitor element. The capacitor element shall consist of alternate layers of glass dielectric and electrode.
3.4.2 Case. Each capacitor shall be enclosed in a glass, porcelain, or epoxy case that will protect the capacitor
element from the effects of prolonged exposure to high humidity under all the test conditions specified herein.
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