MIL-PRF-49464/1C
REQUIREMENTS:
Dimensions and configuration: See figure 1.
Case type: Single layer, unencapsulated, with and without buried electrodes inside.
Termination configuration: A, B, or C as shown in figure 1.
Termination finish:
H: A minimum of 100 microinches of 99.99 percent gold, on both sides. This is suitable for gold wire bonding
and conductive epoxy or AuSn eutectic die attachment.
Operating temperature range: -55C to +125C.
TABLE I. Temperature coefficient F capacitor characteristics.
Case sizes
Cap.
Volt. Temp.
Part or Identifying
B C D E F G H J K Tolerance
(pF)
(dc) coeff.
Number (PIN) 1/
12 15 17 20 22 25 27 30 35
M49464F010R9-AB-H-
0.9
16
F
B
A,B,C,D
M49464F011R8-AC-H-
1.8
16
F
C
A,B,C,D
M49464F012R0-AD-H-
2.0
16
F
D
A,B,C,D
M49464F012R2-AD-H-
2.2
16
F
D
B,C,D
M49464F013R0-AE-H-
3.0
16
F
E
B,C,D
M49464F013R3-A--H-
3.3
16
F
E
F
B,C,D
M49464F013R6-AF-H-
3.6
16
F
F
B,C,D
M49464F013R9-AG-H-
3.9
16
F
G
B,C,D
M49464F014R3-A--H-
4.3
16
F
GH
B,C,D
M49464F014R7-AH-H-
4.7
16
F
H
B,C,D
M49464F017R5-AJ-H-
7.5
16
F
J
B,C,D
M49464F01100-AK-H-
10
16
F
K
J,K,M
M49464F010R6-BB-H-
0.6
25
F
B
A,B,C,D
M49464F010R7-BB-H-
0.7
25
F
B
A,B,C,D
M49464F010R8-BB-H-
0.8
25
F
B
A,B,C,D
M49464F011R2-BC-H-
1.2
25
F
C
A,B,C,D
M49464F011R5-B--H-
1.5
25
F
CD
A,B,C,D
M49464F011R8-BD-H-
1.8
25
F
D
A,B,C,D
M49464F012R0-BE-H-
2.0
25
F
E
A,B,C,D
M49464F012R2-B--H-
2.2
25
F
E
F
B,C,D
M49464F012R4-B--H-
2.4
25
F
E
F
B,C,D
M49464F012R7-B--H-
2.7
25
F
E
FGH
B,C,D
M49464F013R0-B--H-
3.0
25
F
FGH
B,C,D
M49464F013R3-B--H-
3.3
25
F
GH
B,C,D
M49464F013R6-B--H-
3.6
25
F
GH
B,C,D
M49464F013R9-BH-H-
3.9
25
F
H
B,C,D
M49464F014R7-BJ-H-
4.7
25
F
J
B,C,D
M49464F015R1-BJ-H-
5.1
25
F
J
B,C,D
See footnotes at end of table.
2