MIL-PRF-39022/2G
Solderability: Method 208 of MIL-STD-202.
Shock (specified pulse): Method 213 of MIL-STD-202, condition I.
50 percent of rated voltage applied.
DWV, IR, Capacitance, and DF: Same as for immersion.
Terminal strength: Method 211 of MIL-STD-202, conditions A and D.
Condition A: Applied force 5 pounds.
Condition D: 3 rotations of 360 degrees.
Low temperature and capacitance change with temperature:
Low temperature: -55°C +0°C, -3°C for 48 hours ± 4 hours with rated voltage applied.
Capacitance change with temperature:
At -55°C +0°C, -3°C: -10 percent, maximum.
At +125°C +4°C, -0°C: +20 percent maximum.
Fungus: Method 508 of MIL-STD-810.
Resistance to soldering heat: Method 210 of MIL-STD-202, condition C, except the time shall be 10 seconds
± 1 second.
IR: See table II.
Capacitance: Within ± 5 percent of initial value.
DF: Not more than 1.0 percent.
Life: Method 108 of MIL-STD-202.
Qualification:
Accelerated conditions: 140 percent of rated voltage for 2,000 +72, -0 hours.
Rated conditions: 100 percent of rated voltage for 10,000 +96, -0 hours.
DF (at +125°C +4°C, -0°C) between 24 and 48 hours of test: 2 percent, maximum.
During last 48 hours of test: 2.5 percent, maximum.
IR:
Insulating sleeves: 100 megohms, minimum.
Terminal to terminal: Not less than 33.3 percent of initial requirement.
Terminals to case (when case is not a terminal): 5,000 megohms, minimum.
Capacitance: Within ± 10 percent of initial value.
DF (at +25°C ± 3°C after life): 1.25 percent.
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