MIL-DTL-3965/21F
DC leakage (DCL) (max) (at +25°C):
See table I.
Dissipation factor (DF) (max):
15% (≤50 v) or 12% (>50 v).
Seal: In accordance with MIL-DTL-3965.
Dielectric withstanding voltage (DWV):
Sleeving to case (min) - Not applicable.
Terminal to case (min) - 300 volts.
Insulation resistance:
Sleeving to case (min) - Not applicable.
Terminal to case (min) - 100 megohms.
Temperature cycling:
DCL (max) - 125% of 25°C value of table I.
ĆCap - Within ±5% of initial measurement.
DF (max) - 115% of initial requirement.
Solderability: In accordance with method 208 of MIL-STD-202.
Terminal strength:
Pull test - In accordance with MIL-DTL-3965.
Bend test (if req.) - In accordance with MIL-DTL-3965.
Torque test - Not applicable.
Wire-lead bend test - Not applicable.
Twist test - Not applicable.
Surge voltage: See table I.
Moisture resistance:
DCL (max) - 125% of 25°C value of table I.
ĆCap - Within ±8% of initial measurement.
DF (max) - 115% of initial requirement.
Low temperature (storage):
DCL (max) - See table I (25°C)
ĆCap - Within ±5% of initial measurement.
DF (max) - Shall not exceed initial requirement.
Stability at low and high temperature:
Step 1 (+25°C):
DCL (max) - See table I.
Cap - Within tolerance of table I value.
DF (max) - See table I.
Step 2 (-55°C):
Impedance - See table I.
ĆCap (max) - -35% of step 1 value.
Step 3 (+25°C):
DCL (max) - See table I.
ĆCap - Within ±5% of step 1 value.
DF (max) - Shall not exceed initial requirement.
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