MIL-PRF-87217A
3.3 QPL system. The manufacturer shall establish and maintain a QPL system for parts covered by this
specification. Requirements for this system are specified in MIL-STD-690 and MIL-STD-790 and herein. As part of
the MIL-STD-790 QPL system, the manufacturer shall establish and document a system which would include the
following:
a.
Traceability of materials.
b.
Capacitor design requirements.
c.
Dielectric film type.
d.
Dielectric film thickness and width.
e.
Metallization thickness and width.
f.
Metallization resistivity.
g.
Case length and diameter.
h.
Additional material wound at start and stop.
i.
Visual inspection criteria.
3.4 Materials. The materials shall be as specified herein. However, when a definite material is not specified, a
material shall be used which will enable the capacitors to meet the performance requirements of this specification.
Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the
finished product.
3.4.1 Impregnant and filling compounds. Compounds used in the impregnation and filling of capacitors shall be
chemically inactive with respect to the capacitor element and the case. The compound, either in the state of original
application or as a result of having aged, shall have no adverse effect on the performance of the capacitor. For
liquid-filled capacitors, the same material shall be used for impregnating as is used for filling.
3.4.2 Metals. Metals shall be of a corrosion-resistant type or shall be plated or treated to resist corrosion. Silver
plating shall not be used in any external portions of these capacitors.
3.4.2.1 Dissimilar metals. Where dissimilar metals are used in intimate contact with each other, provision shall be
made to provide protection against electrolysis and corrosion. The use of dissimilar metals in contact, which may
tend toward active electrolytic corrosion (particularly brass, copper, or steel used in contact with aluminum or
aluminum alloy), shall not be acceptable. However, metal plating or metal spraying of dissimilar metals to base
metals to provide similar or suitable abutting surfaces will be permitted (for example, the spraying of copper on
aluminum for soldering operations will be permitted). The use of dissimilar metals separated by insulating material
will also be permitted.
3.4.3 Solder. Solder shall not contain more than 97 percent tin.
3.5 Interface and physical dimension requirements. Capacitors and retainers shall meet the interface and
physical dimensions specified (see 3.1).
3.5.1 Case. Each capacitor shall be enclosed in a hermetically-sealed case (see 3.1) which will protect the
capacitor element from moisture, impregnant or filling compound leakage, and mechanical damage under all test
conditions specified herein.
3.5.2 Sleeving. The sleeving material shall not soften, creep, or shrink to a point where any part of the cylindrical
portion of the case is left uncovered at any test temperature specified herein. The sleeving shall not obscure the
part marking.
3.5.3 Leads. Leads shall be solderable and meet the requirements of 3.15.
3.6 Thermal shock. When tested as specified in 4.7.2, capacitors shall withstand the extremes of high and low
temperatures without visible damage.
3.7 Burn-in. When tested as specified in 4.7.3, capacitors shall withstand the exposure to high temperature and
voltage without visible damage.
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