MIL-PRF-23269/10D
REQUIREMENTS:
Design and construction:
Dimensions and configuration: See figure 1, figure 2, and figure 3 and table I, table II, and table III.
Case material: Epoxy.
Terminals: Solderable
Rated voltage: 300 V dc.
Failure rate level: M, P, R, or S.
Rated temperature: -55°C to +125°C.
Temperature coefficient: 140 parts per million (ppm)/°C ±25 ppm/°C.
Capacitance drift: 0.1 percent or 0.1 pF, whichever is greater.
Seal: Test II of MIL-PRF-23269.
Insulation resistance: 10,000 megohms (qualification inspection only at +125°C). 100,000 megohms minimum (at
+25°C).
Dissipation factor (DF): 0.2 percent maximum (1.0 pF through 100 pF) or 0.1 percent maximum (110 pF and up).
Thermal shock and moisture resistance, qualification and group C inspection:
DF: 0.3 percent maximum (1 pF through 100 pF) or 0.1 percent maximum (110 pF and up).
Thermal shock, group A inspection: Capacitance shall be within the tolerance specified (see table I). DF shall be
within the initial limits.
Quality factor (Q): 500 minimum (1.0 pF through 100 pF) or 1,000 minimum (110 pF and up).
Life:
ĆCapacitance (240 hours and 2,000 hours): 0.5 percent or 0.5 pF, maximum.
DF (240 hours and 2,000 hours): 0.45 percent maximum (1.0 pF through 100 pF) or 0.25 percent maximum (110
pF and up).
Marking:
"M" Part or Identifying Number (PIN)
"J" Brand in lieu of slash
M23269J
10-3001
TM 09A
|
Trademark
Year
Sequential 4 week lot code
code
Substitutability data: See table IV.
2
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