MIL-C-11015/11F
Dissipation factor (DF): 1.5 percent, maximum (voltage-temperature limit BX) or 2.0 percent, maximum (voltage-
temperature limits AW and AY).
Vibration, high frequency: In accordance with MIL-C-11015 and method 204 of MIL-STD-202, condition D (20 g's).
Thermal shock and immersion: In accordance with MIL-C-11015.
DWV - 250 percent of rated voltage for voltage-temperature limits W and X, or 200 percent of rated voltage
for voltage-temperature limit Y.
IR - 150,000 megohms, minimum.
Salt spray (corrosion): Not applicable.
Terminal strength: In accordance with MIL-C-11015.
Moisture resistance: In accordance with MIL-C-11015.
DWV - 250 percent of rated voltage for voltage-temperature limits W and X, or 200 percent of rated voltage
for voltage-temperature limit Y.
IR - 150,000 megohms, minimum.
Cap. - Within tolerance of table I value.
Solderability: In accordance with MIL-C-11015. 2 terminals.
Resistance to soldering heat: In accordance with MIL-C-11015.
IR - 200,000 megohms, minimum.
Cap. -
5 percent of initial measurement.
DF - 0.5 percent, maximum.
Voltage-temperature limits: In accordance with MIL-C-11015.
Life (at elevated ambient temperature): In accordance with MIL-C-11015.
Test potential - 200 percent of rated voltage.
DWV - 250 percent of rated voltage for voltage-temperature limits AW and BX, or 200 percent of rated
voltage for voltage-temperature limit AY (at 25 C).
IR - 100,000 megohms, minimum (at high temperature and 25 C).
Cap. - Within tolerance of table I value (at 25 C).
DF - 1.5 percent, maximum (voltage-temperature limit BX) or 2.0 percent, maximum (voltage-temperature
limits AW and AY) (at 25 C).
Marking: In accordance with MIL-C-11015.
Changes from previous issue: Marginal notations are not used in this revision to identify changes with respect to
the previous issue due to the extent of the changes.
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