MIL-PRF-39006/19A
Solderability: Not applicable.
Terminal strength:
Pull: Method 211 of MIL-STD-202, condition A.
Bend (if required): Method 211 of MIL-STD-202, condition B.
Surge voltage: See table I.
Moisture resistance: Method 106 of MIL-STD-202.
DCL: 125 percent (max) of 25°C value of table I.
ĆCap.: Within ±8 percent of initial measurement.
DF: 115 percent (max) of initial requirement.
Dielectric withstanding voltage (DWV): Not applicable.
Insulation resistance (IR): Not applicable.
Low temperature (storage): Method 502 of MIL-STD-810.
DCL: See table I.
ĆCap.: Within ±5 percent of initial measurement.
DF: See table I.
Stability at low and high temperatures:
Step 1 (+25°C):
DCL: See table I.
Cap.: Within tolerance of table I value.
DF: See table I.
Step 2 (-55°C):
Imp.: See table I.
ĆCap.: -60 percent (20 V), -45 percent (30 V), or -35 percent
(>30 V) of step 1 value (max).
Step 3 (+25°C):
DCL: See table I.
ĆCap.: Within ±5 percent of step 1 value.
DF: See table I.
Step 4 (+85°C):
DCL: See table I.
ĆCap.: +15 percent (<30 V) or +10 percent (>30 V) of step 1 value (max).
DF: See table I.
Step 5 (+125°C): 1/
DCL: See table I.
ĆCap.: +20 percent (<26 V) or +10 percent (>26 V) of step 1 value (max).
DF: See table I.
Step 6 (+25°C):
DCL: See table I.
ĆCap.: Within ±5 percent of step 1 value.
DF: See table I.
Reverse voltage: Not applicable.
Life at 85°C: Method 108 of MIL-STD-202.
2,000-hr (qualification):
DCL: See table I.
ĆCap.: Within ±15 percent of initial measurement.
DF: See table I.
1/ 125°C derated voltage referenced.
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